In semiconductor manufacturing,Wafer box serves as the core carrier for wafer storage and transmission,Its cleanliness directly affects the chip yield。Traditional manual cleaning or semi-automatic equipment is prone to residual pollution due to operational differences,andSnowflake cleaning machineWith dry ice particle blasting technology,Provided standardization for the cleaning of crystal round boxes、Highly automated solutions,Becoming a key link in promoting intelligent manufacturing。

Dry ice cleaning:Standardized cleaning“Physical cheating”

Snowflake cleaning machine uses high-pressure gasification of liquid stateCO₂,Generate micron sized dry ice particles(diameter10-100μm),Jet at supersonic speed onto the surface of the crystal box。When dry ice particles collide with pollutants, they vaporize instantly(Volume expansion800times),Generate micro explosion effect,Peel off particles、Residual organic matter and other substances,And without introducing chemical impurities。This process relies entirely on physical actions,Avoiding the need for manual cleaning due to wiping force、Fluctuations in cleanliness caused by differences in solvent concentration,Developed for cleaning crystal round boxes“Unified standards”。

Automated integration:follow“Single machine homework”arrive“Full chain collaboration”

Traditional cleaning equipment requires manual loading and unloading of materials、Switch cleaning program,Low efficiency and prone to errors。Snowflake cleaning machine achieves automation upgrade through three major designs:

1. Robot linkage:Integrated six axis robotic arm,Can be used with wafer box storage cabinets、Seamless docking of transmission tracks,achieve“Automatic grabbing-clean-homing”Unmanned entire process,The single cleaning cycle has been shortened to3minutes in。
2. Intelligent parameter control:Built in sensor for real-time monitoring of crystal round box material(asPP、PEEK)、pollution kinds(Like particles、metal ion),Automatically adjust the size of dry ice particles、Injection pressure,Ensure consistent cleanliness in different scenarios。
3. Data traceability system:Record the pressure during the cleaning process、temperature、Key parameters such as time consumption,Generate an electronic report and upload it toMESsystem,Meet the traceability requirements of the semiconductor industry for production data。

Compared to traditional technology:Dual improvement in efficiency and yield

• Cleaning efficiency:Manual cleaning is required15minute/box,And it is easy to overlook blind spots；The snowflake cleaning machine adopts360°Rotating nozzle,Cover the inner wall of the wafer box、Complex structures such as card slots,Single box cleaning time compressed to2minute,Efficiency improvement6times。
• Yield guarantee:Traditional wet cleaning may cause cross contamination of wafers due to solvent residue,Dry ice cleaning does not involve any liquid,After cleaning, the surface of the crystal round box is dry and free of residue,Reduced scrap rate of chips due to pollution30%the above。
• cost optimization:Automated operation reduces manual intervention,A single production line can save2-3Name operator；The cost of dry ice pellets is only equivalent to that of chemical solvents1/5,Long term use can reduce the overall cost of cleaning40%。

Application scenarios:Covering the entire lifecycle of wafer packaging

• Production front-end:Before the wafer is loaded into the box,Deeply clean the empty box,Remove dust during transportation、Fiber and other particles,Avoid contaminating the initial wafer。
• Mid section of production line:Quickly clean the used wafer box,Support production line24Continuous operation for hours,Reduce downtime and waiting caused by cleaning。
• recycling:Refurbish and clean retired wafer boxes,Remove stubborn stains accumulated from long-term use,Extend the service life of equipment,Reduce procurement costs。

Industry Trends:follow“Device Upgrade”arrive“Ecological Restructure”

As semiconductor manufacturing moves towards40nmThe following processes are advancing,The cleanliness requirements for wafer packaging have been revised“Micron level”Upgrade to“Nanoscale”。The snowflake cleaning machine is transitioning from a single device to“Intelligent cleaning unit”evolution:

• Modular design:Support quick replacement of nozzles、Adjust the spray angle,Adapt to different sizes of crystal round boxes(as25on chip、50on chip)Cleaning requirements。
• AIpredictive maintenance:By analyzing equipment operation data,Early warning of nozzle blockage、Malfunctions such as air leakage,Reduce unplanned downtime。
• Cross factory collaboration:With wafer fabs、Equipment vendors jointly build a clean standard database,Drive the industry forward“Experience driven”direction“data driven”transformation。