In semiconductor manufacturing,The control of nanoscale pollutants on the surface of wafers directly determines the yield and performance of chips。Traditional cleaning techniques(Like wet cleaning、scrub)Easy residual particles、Metal ions or causing surface scratches,Difficult to meet advanced process requirements(as3nm、2nm)Strict requirements。Snowflake cleaning machineWith its unique dry ice particle blasting technology,Becoming the solution to this problem“The Ultimate Weapon”。

Dry ice particles:Nano level pollution“Precision Hunter”

The core principle of the snowflake cleaning machine is to use liquidCO₂Instantly vaporize under high pressure,Form micrometer sized dry ice particles(diameter5-50μm),At supersonic speed(300-700m/s)Spray onto the surface of the wafer。Dry ice particles occur when they collide with pollutantsMetastable burst,Generate micro explosion effect,Convert nanoscale particles(as0.1μmThe following metal fragments、Photoresist residue)Peel off from the surface of the wafer,At the same time, avoid scratches caused by physical contact。

Compared to traditional technology:Three major advantages reshape cleaning standards

1. Non destructive cleaning:Traditional wet cleaning relies on chemical agents,Possible introduction of metal ion pollution；The snowflake cleaning machine adopts a purely physical method,No chemical residues,Especially suitable for wafer pre-processing with high purity requirements(Like photolithography、Cleaning after ion implantation)。
2. Efficient decontamination:The explosive energy of dry ice particles can penetrate deep into the microstructure of the wafer surface(asTSVthrough-hole、3DGap in stacked structure),Eliminate pollutants in blind spots that are difficult to reach with traditional methods,Improved cleaning efficiency50%the above。
3. Environmental protection and energy conservation:Dry ice cleaning process without wastewater discharge,AndCO₂Recyclable and reusable,In line with the trend of green manufacturing in the semiconductor industry；The gas consumption of a single device is reduced compared to traditional sandblasting cleaning60%,Assist enterprises in reducing costs and increasing efficiency。

Application scenarios:Covering the entire semiconductor industry chain

• wafer fabrication:During photoresist stripping、CMPCleaning and other steps after polishing,Snowflake cleaning machine can reduce particle defect rate(Particle Adders)exceed90%,Significantly improve yield rate。
• Advanced Packaging:be directed against3DCopper pillar in packaging、Cleaning of micro bumps,Flexible impact of dry ice particles to avoid damage to precision structures,Ensure signal transmission stability。
• Equipment maintenance:Used for cleaning lithography machine mask templates、Key components such as wafer transfer robots,Extend equipment lifespan,Reduce downtime maintenance costs。

Technological iteration:follow“Can be washed”arrive“Accurate washing”

The new generation of snowflake cleaning machine has been integratedAIVisual inspection system,Real time identification of wafer surface pollutant types and distribution,Automatic adjustment of injection parameters(Like particle size、Spray angle),achieve“One crystal, one strategy”Customized cleaning。for example,For third-generation semiconductor materials(Like silicon carbide、gallium nitride)The hard surface,The device can be switched to“Hard mode”,Enhance the impact force of dry ice particles；And for flexible substrates(Like glass based chips),Then switch to“floppy mode”,Avoid material deformation。

Industry recognition:The leap from laboratory to mass production

currently,Multiple leading wafer fabs worldwide(Like TSMC、Intel)The snowflake cleaning machine has been included12Standard configuration of inch production line。data shows,After adopting this technology,3nmThe yield improvement of process chips is about8%,Reducing the cost of cleaning a single wafer15%。along withEUVPhotolithography、GAAThe demand for cleanliness in new technologies such as transistors continues to rise,The snowflake cleaning machine is currently in operation“Alternative”Upgrade to“Required equipment”。