In the semiconductor manufacturing industry,The surface cleanliness of a wafer has a crucial impact on the performance and reliability of the entire chip。With the development of integrated circuit equipment towards higher precision and smaller sizes,The requirements for wafer surface treatment are becoming increasingly strict。Snowflake cleaning technology(snow cleaning technology),As an efficient and environmentally friendly cleaning method,It has become an important technology in wafer surface treatment。

The basic principles of snowflake cleaning technology

Snowflake cleaning technology utilizes solid carbon dioxide(dry ice)granule,Spray onto the wafer surface under specific pressure and temperature。When dry ice particles come into contact with the surface,They will immediately transition from solid to gas,Sublimation occurs immediately。During this process,The mechanical force generated by the rapid expansion of dry ice particles can effectively remove the particles on the surface of the wafer、Removal of organic matter and other pollutants。

The advantages of snowflake cleaning in wafer surface treatment

No chemical residues:Compared to traditional wet chemical cleaning,Snowflake cleaning does not rely on chemical reagents,Therefore, there will be no chemical residue left on the wafer surface。

Non contact cleaning:Snowflake cleaning is a non-contact cleaning method,Can avoid damage to fragile wafer surfaces caused by mechanical contact。

Environmental protection and safety:The carbon dioxide used can be recycled,Meets the environmental requirements of modern semiconductor manufacturing industry。

Efficient and fast:Snowflake cleaning can be quickly completed,Greatly improved production efficiency,Especially suitable for large-scale wafer processing。

Application in surface treatment of semiconductor wafers

Pre treatment cleaning:Before starting photolithography or other subsequent processing on the wafer,It is necessary to ensure that its surface is clean and dust-free。Snowflake cleaning can effectively remove dust and particles generated during cutting and grinding processes。

Surface preparation before photolithography:Before the photolithography step,It is necessary to ensure that the wafer surface is completely free of pollutants,Any slight pollution can affect the quality of lithography。

Remove processing residues:Chemical mechanical grinding of wafers(CMP)After the process,All grinding slurry residues and other pollutants need to be removed,Snowflake cleaning provides an efficient solution。

epilogue

Snowflake cleaning technology has demonstrated its unique advantages in surface treatment of semiconductor wafers,Not only does it ensure the cleanliness of the wafer,It also improves the efficiency and reliability of the entire production process。With the continuous progress of semiconductor technology and increasingly stringent environmental requirements,It is expected that snowflake cleaning technology will be more widely applied,Becoming one of the important processes for wafer surface treatment。